Semiconductor & Sensor Packaging Expo 2025

Name: Semiconductor & Sensọ nkwakọ ngwaahịa Expo
Start: 2025-01-22T09:30:00+08:00
End: 2025-01-24T18:00:00+08:00
Location: Koto - Tokyo Big Sight, Tokyo, Japan

registration Rịọ ụlọ ntu ulo

Bipute Comments

From January 22, 2025 until January 24, 2025

At Koto - Tokyo Big Sight, Tokyo, Japan - ((Gosi map)

(Biko lelee ụbọchị na ọnọdụ ugboro abụọ na saịtị gọọmentị dị n'okpuru tupu ịga.)

https://www.nepconjapan.jp/hub/en-gb/about/ic-sensor-packaging-technology-expo.html

Categories: Eletriki & Eletrọniki, Mbukota na ngwugwu

Tags: packaging, Ndi ihe omumu

ISP - IC & Sensor nkwakọ teknụzụ EXPO

Ihe ngosi ngosi nke Asia maka nrụpụta IC ikpeazụ, na-achịkọta akụrụngwa, akụrụngwa na ọrụ dị elu. Ndị otu kọmitii ọgbakọ. Biko kpọtụrụ anyị ma ọ bụrụ na ị nwere ajụjụ ọ bụla.

Ndị isi ụlọ ọrụ na-esote ahaziwo mmemme nnọkọ maka ogbako teknụzụ.

Onye nhazi: RX Japan Ltd.NEPCON JAPAN njikwa ihe ngosi.

TEL: +81 3 6739 4102E-mail: Maka ngosi>>[email protected] / Maka nleta>> [email protected].

Ọnụọgụ ndị a bụ atụmatụ. Nọmba ndị a nwere ike ịdị iche na ndị nọ na ihe ngosi ahụ.